HIGH PERFORMANCE DEVICES
Proceedings of the 2004 IEEE Lester Eastman Conference
Rensselaer Polytechnic Institute, 4 – 6 August 2004
CONTENTS
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FRONT MATTER
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VERTICAL SCALING OF TYPE I InP HBT WITH FT > 500 GHZ
J.W. LAI, W. HAFEZ and M. FENG | 1 |
NUMERICAL INVESTIGATION OF THE EFFECT OF DOPING PROFILES ON THE HIGH FREQUENCY PERFORMANCE OF InP/InGaAs SUPER SCALED HBTs
DMITRY VEKSLER, MICHAEL S. SHUR, V.E. HOUTSMA, N.G. WEIMANN and Y.K. CHEN | 8 |
TUNNEL DIODE/TRANSISTOR DIFFERENTIAL COMPARATOR
QINGMIN LIU, SURAJIT SUTAR and ALAN SEABAUGH | 16 |
BENCHMARK RESULTS FOR HIGH-SPEED 4-BIT ACCUMULATORS IMPLEMENTED IN INDIUM PHOSPHIDE DHBT TECHNOLOGY
STEVEN EUGENE TURNER and DAVID E. KOTECKI | 22 |
ATOMICALLY FLAT III-ANTIMONIDE EPILAYERS GROWN USING LIQUID PHASE EPITAXY
ANIKA KUMAR, SUJATHA SRIDARAN and P. S. DUTTA | 28 |
NATIVE DEFECT COMPENSATION IN III-ANTIMONIDE BULK SUBSTRATES
ROBINSON PINO, YOUNGOK KO and PARTHA S. DUTTA | 34 |
NOISE AND THZ RECTIFICATION CHARACTERISTICS OF ZERO-BIAS QUANTUM TUNNELING SB-HETEROSTRUCTURE DIODES
ARTTU LUUKANEN, ERICH N. GROSSMAN, HARRIS P. MOYER and JOEL N. SCHULMAN | 40 |
TEMPERATURE DEPENDENCE OF TERAHERTZ EMISSION FROM SILICON DEVICES DOPED WITH BORON
R. T. TROEGER, T. N. ADAM, S. K. RAY, P.-C. LV, S. KIM and J. KOLODZEY | 46 |
TWO-DIMENSIONAL ANALYTICAL MODELING AND SIMULATION OF RETROGRADE DOPED HMG MOSFET
R.S GUPTA, KIRTI GOEL, MRIDULA GUPTA and MANOJ SAXENA | 52 |
ELECTRICAL EFFECTS OF DNA MOLECULES ON SILICON FIELD EFFECT TRANSISTOR
G. XUAN, J. KOLODZEY, V. KAPOOR and G. GONYE | 60 |
ANALYSIS OF OPERATIONAL TRANSCONDUCTANCE AMPLIFIER FOR APPLICATION IN GHz FREQUENCY RANGE
A. GHORI and P. GHOSH | 66 |
LIFETIME OF NONEQUILIBRIUM CARRIERS IN AlGaN EPILAYERS WITH HIGH Al MOLAR FRACTION
J. MICKEVICIUS, R. ALEKSIEJUNAS, M. S. SHUR, J. P. ZHANG, Q. FAREED, R. GASKA and G. TAMULAITIS | 72 |
NOISE CHARACTERISTICS OF 340 nm AND 280 nm GaN-BASED LIGHT EMITTING DIODES
SHAYLA SAWYER, SERGEY L. RUMYANTSEV, NEZIH PALA, MICHAEL S. SHUR, YURIY BILENKO, REMIS GASKA, PAVEL V. KOSTERIN and BRIAN M. SALZBERG | 78 |
JUNCTION-TEMPERATURE MEASUREMENTS IN GaN UV LIGHT-EMITTING DIODES USING THE DIODE FORWARD VOLTAGE
Y. XI and E. F. SCHUBERT | 84 |
High Speed 0.9 μm Lateral p-i-n Photodetectors Fabricated in a Standard Commercial GaAs VLSI Process
WOJCIECH P. GIZIEWICZ, CLIFTON G. FONSTAD, Jr. and SHEILA PRASAD | 90 |
SELF-GUIDING IN LOW-INDEX-CONTRAST PLANAR PHOTONIC CRYSTALS
CAIHUA CHEN, ZHAOLIN LU, SHOUYUAN SHI and DENNIS W. PRATHER | 96 |
OMNI-DIRECTIONAL REFLECTOR USING A LOW REFRACTIVE INDEX MATERIAL
J.-Q. XI, MANAS OJHA, WOOJIN CHO, TH. GESSMANN, E. F. SCHUBERT, J. L. PLAWSKY and W. N. GILL | 102 |
MBE-Grown AIGaN/GaN HEMTs on SiC
SIDDHARTH RAJAN, ARPAN CHAKRABORTY, UMESH K. MISHRA, CHRISTIANE POBLENZ, PATRICK WALTEREIT and JAMES S. SPECK | 108 |
STABLE HIGH POWER GaN-ON-GaN HEMT
K.K. CHU, P.C. CHAO and J.A. WINDYKA | 114 |
THICK GaN LAYER GROWN BY Ga VAPOR TRANSPORT TECHNIQUE
HUAQIANG WU, PHANIKUMAR KONKAPAKA, YURI MAKAROV and MICHAEL G. SPENCER | 121 |
DEPENDENCE OF RF PERFORMANCE OF GaN/AlGaN HEMTS UPON AlGaN BARRIER LAYER VARIATION
ELIAS FARACLAS, RICHARD T. WEBSTER, GEORGE BRANDES and A. F. M. ANWAR | 126 |
SELECTIVE DRY ETCHING OF GaN OVER AlGaN IN BCL3/SF6 MIXTURES
D. BUTTARI, A. CHINI, A. CHAKRABORTY, L. MCCARTHY, H. XING, T. PALACIOS, L. SHEN, S. KELLER and U. K. MISHRA | 132 |
LOW FREQUENCY NOISE PARAMETERS IN AN AlGaN/GaN HETEROSTRUCTURE WITH 33% AND 75% Al MOLE FRACTION
S.A. VITUSEVICH, S.V. DANYLYUK, N. KLEIN, M.V. PETRYCHUK, A.E. BELYAEV, A. VERTIATCHIKH and L.F. EASTMAN | 138 |
TRAP BEHAVIOR IN AlGaN/GaN HEMTs BY POST-GATE-ANNEALING
HYEONGNAM KIM, JAESUN LEE and WU LU | 145 |
PHOTOCAPACITANCE OF GaAs THIN-FILM STRUCTURES FABRICATED ON A SEMI-INSULATING COMPENSATED SUBSTRATE
NIKOLAI B. GOREV, INNA F. KODZHESPIROVA, EVGENY N. PRIVALOV, NINA KHUCHUA, LEVAN KHVEDELIDZE and MICHAEL S. SHUR | 151 |
UNSTRAINED InAlN/GaN HEMT STRUCTURE
M. NEUBURGER, T. ZIMMERMANN, E. KOHN, A. DADGAR, F. SCHULZE, A. KRTSCHIL, M. GÜNTHER, H. WITTE, J. BLÄSING, A. KROST, I. DAUMILLER and M. KUNZE | 161 |
GaN MOS-HEMT USING ATOMIC LAYER DEPOSITION Al2O3 AS GATE DIELECTRIC AND SURFACE PASSIVATION
P.D. Ye, B. Yang, K.K. Ng, J. Bude, G.D. Wilk, S. Halder and J.C.M. Hwang | 167 |
DEPENDENCE OF ELECTRON MOBILITY ON EPI CHANNEL DOPING IN GaN MOSFETS
J. RUAN, K. MATOCHA, W. HUANG and T.P. CHOW | 173 |
FABRICATION OF SELF-ALIGNED T-GATE AlGaN/GaN HIGH ELECTRON MOBILITY TRANSISTORS
JAESUN LEE, DONGMIN LIU, HYEONGNAM KIM, MICHAEL L. SCHUETTE, WU LU, JEFFREY S. FLYNN and GEORGE R. BRANDES | 181 |
A NEW FIELD-PLATED GaN HEMT STRUCTURE WITH IMPROVED POWER AND NOISE PERFORMANCE
HONGTAO XU, CHRISTOPHER SANABRIA, ALESSANDRO CHINI, YUN WEI, STEN HEIKMAN, STACIA KELLER, UMESH K. MISHRA and ROBERT A. YORK | 186 |
NOISE CHARACTERISTICS OF FIELD-PLATED GAN HEMTS
Y.-F. WU, M. MOORE, T. WISLEDER, P.M. CHAVARKAR, P. PARIKH and A. SAXLER | 192 |
TEMPERATURE DEPENDENT I-V CHARACTERISTICS OF AlGaN/GaN HBTS AND GaN BJTS
HUILI G. XING and UMESH K. MISHRA | 195 |
ANALYSIS OF HIGH DC CURRENT GAIN STRUCTURES FOR GaN/InGaN/GaN HBTs
JAMES C. LI, DAVID M. KEOGH, SOUROBH RAYCHAUDHURI, ADAM CONWAY, DONGJIANG QIAO and PETER M. ASBECK | 201 |
ANALYSIS OF GaN HBT STRUCTURES FOR HIGH POWER, HIGH EFFICIENCY MICROWAVE AMPLIFIERS
D.M. KEOGH, J.C. LI, A.M. CONWAY, D. QIAO, S. RAYCHAUDHURI, P.M. ASBECK, R.D. DUPUIS and M. FENG | 207 |
LEAKY SURFACE ACOUSTIC WAVES IN SINGLE-CRYSTAL AlN SUBSTRATE
GANG BU, DAUMANTAS CIPLYS, MICHAEL S. SHUR, LEO J. SCHOWALTER, SANDRA B. SCHUJMAN and REMIS GASKA | 213 |
HIGH LINEARITY GaN HEMT POWER AMPLIFIER WITH PRE-LINEARIZATION GATE DIODE
SHOUXUAN XIE, VAMSI PAIDI, STEN HEIKMAN, LIKUN SHEN, ALESSANDRO CHINI, UMESH K. MISHRA, MARK J. W. RODWELL and STEPHEN I. LONG | 223 |
SPICE MODEL OF AlGaN/GaN HEMTs AND SIMULATION OF VCO AND POWER AMPLIFIER
SYED S. ISLAM and A.F.M. ANWAR | 229 |
HIGH POWER, DRIFT-FREE 4H-SiC PIN DIODES
MRINAL K. DAS, JOSEPH J. SUMAKERIS, BRETT A. HULL, JIM RICHMOND, SUMI KRISHNASWAMI and ADRIAN R. POWELL | 236 |
DESIGN OF HIGH VOLTAGE 4H-SiC SUPERJUNCTION SCHOTTKY RECTIFIERS
Lin Zhu, Peter Losee and T. Paul Chow | 241 |
HIGH-VOLTAGE DIAMOND SCHOTTKY RECTIFIERS
W. HUANG, T.P. CHOW, J. YANG and J.E. BUTLER | 248 |
2 KV 4H-SiC DMOSFETS FOR LOW LOSS, HIGH FREQUENCY SWITCHING APPLICATIONS
SEI-HYUNG RYU, SUMI KRISHNASWAMI, MRINAL DAS, JAMES RICHMOND, ANANT AGARWAL, JOHN PALMOUR and JAMES SCOFIELD | 255 |
SIMULATION STUDY ON BREAKDOWN BEHAVIOR OF FIELD-PLATE SiC MESFETs
HO-YOUNG CHA, Y. C. CHOI, LESTER F. EASTMAN and MICHAEL G. SPENCER | 260 |
EFFECTS OF BUFFER LAYER THICKNESS AND DOPING CONCENTRATION ON SiC MESFET CHARACTERISTICS
SANKHA S. MUKHERJEE and SYED S. ISLAM | 266 |
ANALYTICAL MODEL FOR NON-SELF ALIGNED BURIED P-LAYER SiC MESFET
R.S GUPTA, SANDEEP KUMAR AGGARWAL, RITESH GUPTA, MRIDULA GUPTA and SUBHASIS HALDAR | 273 |
ION IMPLANTED SiC STATIC INDUCTION TRANSISTOR WITH 107 W OUTPUT POWER AND 59% POWER ADDED EFFICIENCY UNDER CW OPERATION AT 750 MHZ
G.C. DE SALVO, P.M. ESKER, T.A. FLINT, J.A. OSTOP, E.J. STEWART, T.J. KNIGHT, K.J. PETROSKY, S.D. VAN CAMPEN, R.C. CLARKE and G.M. BATES | 282 |
INFLUENCE OF THE N-DIFFUSION LAYER ON THE CHANNEL CURRENT AND THE BREAKDOWN VOLTAGE IN 4H-SiC SIT
YOUNG CHUL CHOI, HO-YOUNG CHA, LESTER F. EASTMAN and MICHAEL G. SPENCER | 285 |
BACK MATTER
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